硬核分析：基于31部智能手机的射频前端的拆解

射频前端产业观察：

本文引用自SystemPlus的样张报告，所有版权属于原作者。

Last year System Plus opened hundreds of Front-End Modules (FEMs) and components to provide an overview of the RadioFrequency (RF) FEM market in selected flagship smartphones. We gathered the information into four reports to track theevolution of this technology market.

This year, System Plus Consulting again offers technical and cost comparisons of smartphone RFFEMs. Every comparisonreport will focus on a specific subject. It can be a player’s evolution, a specific technology, or a comparison of flagshipdevices.

This, the second volume of 2021, provides insights into technology and cost data for FEMs and several components foundin 31 smartphones from the latest 5G phones. It provides a ranking of 5G phones and suppliers. It features acomprehensive overview of the RFFEM architectures on the market, comparing available smartphones from thesecompanies.

It reveals material substrate trends and main used die functions, along with the different choices in integrationof communication technology.

We even see millimeter wavelength (mmWave) signal support this year. Also, the reportreveals how companies are integrating 5G, from premium to low-end phones.

With teardowns of the smartphones, the main RF modules and components have been extracted and physically analyzed,from the output of the transceiver to the antenna. Packaging, sizes, and technologies are studied to provide a large panelof technical and economic choices and an overview of the market.Every component has been analyzed to understand the manufacturing process cost.Moreover, the report includes a technical and cost comparison of the modules. It also tries to explain the smartphonemakers’ choices and supplier tendencies.

Note: Wifi, Bluetooth and UWB Module are not included in this report